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CHA2693-QAG
RoHS COMPLIANT
18-30GHz Low Noise Amplifier
GaAs Monolithic Microwave IC in SMD leadless package Description
The CHA2693-QAG is a two-stage wide band monolithic low noise amplifier. The circuit is manufactured with a standard PHEMT process : 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in ROHS compliant SMD package.
Main Features
Broadband performance 18-30GHz 3.0dB noise figure, 18-26GHz 13dB gain, 2.0dB gain flatness Low DC power consumption. 20dBm 3rd order intercept point 16L-QFN3x3 SMD package
20 18 16 Gain & NF ( dB ) 14 12 10 8 6 4 2 0 12 14 16 18
CHA2693-QAG ( Vd=4V ; Id=45mA )
NF
dBS21
20 22 24 26 Frequency ( GHz )
28
30
32
34
Main Characteristics
Tamb = +25 Vd = +4.0V, Id = 45mA C, Symbol NF G IP3 Parameter Noise figure, 18-26GHz Gain 3rd order intercept point 10 18 Min Typ 3.0 13 20 Max Unit dB dB dBm
ESD Protections : Electrostatic discharge sensitive device observe handling precautions !
Ref. : DSCHA2693QAG6332 - 28 Nov 06
1/12
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Departementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHA2693-QAG
Electrical Characteristics
18-30GHz Low Noise Amplifier
Tamb = +25 Vd = +4.0V, Vg1=Vg2 to adjust Id = 45 mA C, Symbol Fop G G NF VSWRin VSWRout IP3 P1dB Id Parameter Operating frequency range Gain Gain flatness Noise figure (18 to 26 GHz) Input VSWR (18 to 26 GHz) Ouput VSWR (18 to 26 GHz) 3rd order intercept point Output power at 1dB gain compression Drain bias current 18 10 Min 18 10 13 2.0 3.0 3.0:1 3.0:1 20 12 45 55 dBm dBm mA 2.5 Typ Max 30 Unit Ghz dB dB dB
These values are representative of onboard measurements as defined on the drawing 95542 (see below).
Absolute Maximum Ratings (1)
Tamb = +25 C Symbol Vd Vg Pin
Tj
Parameter (1) Drain bias voltage Gate bias voltage Maximum peak input power overdrive (2) Junction Temperature (3) Operating temperature range Storage temperature range
Values 4.5 -2 to 0 +2.0
175
Unit V V dBm
C
Top Tstg
-40 to +85 -55 to +125
C C
(1) Operation of this device above anyone of these paramaters may cause permanent damage. (2) Duration < 1s. (3) Thermal resistance to ground paddle = 170 C/W fo r Tamb. = +85 (Vd=4v, Id=45mA) C
Ref. : DSCHA2693QAG6332 - 28 Nov 06
2/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
18-30GHz Low Noise Amplifier
CHA2693-QAG
Typical Bias Conditions
for an ambient Temperature of +25 C Symbol Vd Vg1 & 2 Id Pin n 14 6&7 14 Parameter Drain bias voltage First & second stages gate bias voltage (1) Drain current Values 4 -0.4 45 Unit V V mA
(1) Typically, Vg1=Vg2 and Vg1&2 are adjusted so that Id=45mA
Schematic
Ref. DSCHA2693QAG6332 - 28 Nov 06
3/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHA2693-QAG
Typical PCB Measured Performance
Tamb = +25 Vd = +4.0V, Id = 45mA C,
18-30GHz Low Noise Amplifier
CHA2693-QAG
( Vd=4V ; Id=45mA )
20 15 10 5 0 dBSij ( dB ) -5 -10 -15 -20 -25 -30 -35 -40 5 10 15 20 25 Frequency ( GHz ) 30 35 40
dBS11 dBS21 dBS12 dBS22
Sij in the package access planes, using the proposed land pattern & board 95542 Refer to the "definition of the Sij reference planes" section below
CHA2693-QAG
( Vd=4V ; Id=45mA )
20 18 16 Gain & NF ( dB ) 14 12 10 8 6 4 2 0 12 14 16 18 20 22 24 26 Frequency ( GHz ) 28 30 32 34
NF
dBS21
Gain & NF in the board access planes, using the proposed land pattern & board 95542
Ref. : DSCHA2693QAG6332 - 28 Nov 06
4/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
18-30GHz Low Noise Amplifier
Typical Package Sij parametres
Tamb = +25 Vd = +4.0V, Id = 45mA C,
Freq (GHz) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 S11 dB -0.1 -0.1 -0.3 -0.1 -0.3 -0.3 -0.4 -0.5 -0.6 -0.8 -1.0 -1.4 -2.0 -3.8 -8.7 -26.9 -12.2 -7.8 -6.4 -6.2 -5.9 -5.7 -5.2 -4.5 -3.7 -3.1 -2.7 -2.6 -2.7 -3.2 -3.4 -2.8 -1.5 -0.4 -0.3 -0.1 0.0 -0.1 -0.4 -1.2 S11 / -73.4 -129.6 -172.7 151.5 118.7 88.8 60.0 34.7 10.1 -11.3 -32.0 -52.2 -75.6 -102.2 -132.8 -101.3 -35.1 -56.8 -80.4 -97.9 -114.8 -126.7 -138.7 -149.9 -161.6 -173.5 174.4 164.9 157.9 152.5 154.1 155.8 152.8 146.6 135.6 123.6 113.7 101.3 87.1 71.4 S12 dB -71.6 -65.3 -57.5 -53.7 -53.0 -51.3 -51.2 -53.5 -51.8 -53.6 -51.4 -54.6 -52.5 -47.7 -43.0 -41.3 -39.3 -37.5 -37.5 -36.4 -36.7 -34.8 -33.9 -32.9 -32.4 -31.9 -31.9 -31.7 -31.0 -30.1 -31.0 -32.7 -35.9 -40.0 -46.7 -49.9 -38.8 -39.0 -38.3 -41.9 S12 / 150.8 170.7 108.1 85.5 48.0 30.0 9.1 -11.6 -21.1 -29.2 -60.1 -112.9 132.9 65.0 10.8 -26.3 -58.9 -100.9 -127.7 -159.5 178.9 154.9 129.2 103.8 81.1 55.2 33.6 14.2 -6.7 -36.1 -71.0 -102.3 -145.0 168.3 113.9 115.0 21.9 4.5 -35.0 -59.1 S21 dB -32.8 -35.4 -47.5 -39.7 -30.8 -23.5 -16.8 -10.8 -5.3 -0.5 3.4 7.0 10.4 13.0 14.7 15.0 14.7 14.2 13.8 13.4 13.4 13.2 13.1 12.7 12.1 11.5 11.0 10.8 10.9 11.1 11.3 10.8 9.3 7.1 4.2 0.4 -3.1 -6.7 -10.7 -15.3
CHA2693-QAG
S21 / 101.4 10.7 -3.8 115.6 112.6 103.7 86.9 62.4 32.0 -2.4 -39.8 -79.5 -117.3 -165.2 146.6 99.2 56.8 20.1 -14.2 -46.3 -79.4 -111.9 -145.3 -178.6 149.1 118.7 89.2 60.4 29.8 -4.6 -42.3 -85.4 -130.0 -172.0 146.5 109.8 79.9 48.6 18.7 -7.7
S22 dB -0.4 -1.3 -2.6 -3.4 -4.8 -5.4 -6.5 -6.7 -6.9 -7.1 -6.9 -7.3 -7.5 -7.7 -6.6 -5.9 -5.9 -6.1 -7.0 -8.0 -8.9 -8.6 -7.7 -6.6 -5.2 -4.7 -4.2 -4.3 -4.4 -3.7 -2.6 -1.5 -1.7 -3.3 -5.9 -5.8 -4.6 -3.3 -2.5 -2.7
PS22 / -47.4 -90.2 -128.2 -163.7 163.2 130.4 98.1 68.7 41.1 19.1 0.4 -13.7 -31.2 -33.4 -42.6 -56.9 -71.2 -85.7 -101.1 -112.9 -118.0 -123.3 -126.8 -136.9 -148.2 -162.0 -174.9 175.6 170.2 169.4 163.4 149.3 133.7 118.9 118.3 134.0 129.1 124.7 109.7 91.7
Refer to the "definition of the Sij reference planes" section below.
Ref. DSCHA2693QAG6332 - 28 Nov 06
5/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHA2693-QAG
Tamb = +25 Vd = +4.0V, Id = 30, 45 & 55mA C,
18-30GHz Low Noise Amplifier
Typical PCB Measured Performance
Pout -1dB & OIP3 in the in the board access planes, using the proposed land pattern & board 95542
CHA2693-QAG : ( Pout & Id ) vs Pin
( Vd=4V ; Freq=23GHz )
16
Pout @30mA
100
Pout @45mA Pout @55mA Id @30 Id @45 Id @55
14 12 Output Power ( dBm ) 10 8 6 4 2 0 -2 -4
90 80 70 60 50 40 30 20 10 0 Current ( mA )
-15 -14 -13 -12 -11 -10
-9
-8 -7 -6 -5 -4 Input Power ( dBm )
-3
-2
-1
0
1
2
Pin vs Pout & Id at 23GHz, in the board access planes, using the proposed land pattern & board 95542
Ref. : DSCHA2693QAG6332 - 28 Nov 06
6/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
18-30GHz Low Noise Amplifier
Package outline:
CHA2693-QAG
Matt tin, Lead Free Units From the standard
(Green) mm JEDEC MO-220 17- GND
1- NC 2- GND 3- RF IN 4- GND 5- NC 6- VG1 7- VG2 8- NC
9- GND 10- RF OUT 11- GND 12- NC 13- NC 14- VD 15- NC 16- NC
Ref. DSCHA2693QAG6332 - 28 Nov 06
7/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHA2693-QAG
18-30GHz Low Noise Amplifier
Definition of the Sij reference planes
The reference planes are defined from the footprint of the recommended characterization board shown below under the number 95542. The reference is the symmetrical axis of the package. The input and output reference planes are located at 2.65mm offset (input wise and output wise respec.) from this axis. Then, the given Sij incorporates this land pattern.
2.65
2.65
Application note
The design of the motherboard has a strong impact on the over all performance since the transition from the motherboard to the package is comparably large. In case of the SMD type packages of United Monolithic Semiconductors the motherboard should be designed according to the information given in the following to achieve good performance. Other configurations are also possible but can lead to different results. If you need advise please contact United Monolithic Semiconductors for further information.
SMD type packages of UMS should allow design and fabrication of micro- and mm-wave modules at low cost. Therefore, a suitable motherboard environment has been chosen. All tests and verifications have been performed on Rogers RO4003. This material exhibits a permittivity of 3.38 and has been used with a thickness of 200m [8 mils] and a 1/2oz or less copper cladding. The corresponding 50Ohm transmission line has a strip width of about 460m [approx. 18 mils].
The contact areas on the motherboard for the package connections should be designed according to the footprint given above. The proper via structure under the ground pad is very important in order to achieve a good RF and lifetime performance. All tests have been done by using a grid of plenty plated through vias with a diameter of less than 300m [12 mils] and a spacing of less than 700m [28 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias closest to the RF ports should be located near the edge of the pad to allow a good RF ground connection. Since the vias are important for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a grid of via's is recommended.
For the mounting process the SMD type package can be handled as a standard surface mount component. The use of either solder or conductive epoxy is possible. The solder thickness after reflow should be typical 50m [2 mils] and the lateral alignment between the package and the motherboard should be within 50m [2 mils]. Caution should be taken to obtain a good and reliable
Ref. : DSCHA2693QAG6332 - 28 Nov 06 8/12 Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
18-30GHz Low Noise Amplifier
CHA2693-QAG
contact over the whole pad areas. Voids or other improper connections, in particular, between the ground pads of motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product.
(For production, design must be adapted with regard to PCB tolerances and assembly process) Basic footprint for a 16L-QFN3x3 (all units mm) (Please, refer to the UMS propose footprint for optimum operation in the following "Proposed Assembly board" section)
The RF ports are DC blocked on chip. The DC connection (Vd) does not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the PC board, as close as possible to the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB assembly process. The dimensions and footprint required for the PCB (motherboard) are given in the drawings above. For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017.
Ref. : DSCHA2693QAG6332 - 28 Nov 06
9/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHA2693-QAG
Proposed Assembly characterization.
-
18-30GHz Low Noise Amplifier
board for the 16L-QFN3x3 products
-
Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board.
Ref. : DSCHA2693QAG6332 - 28 Nov 06
10/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
18-30GHz Low Noise Amplifier
Proposed external on-board matching.
CHA2693-QAG
- The performances of this product might be enhanced using external matching components such as very simple combination of micro-strip stubs and slugs. The schematic shown below help to define the board dedicated to the typical subband in the range 18 to 30GHz. Based on the Sij matrix given previously, more accurate, or dedicated frequency boards may be derived.
All in m Freq (GHz) 17.0-20.0 21.0-24.0 24.5-26.5 27.5-29.5 29.5-30.0 20.0-28.0 L1 935 555 290 145 95 325 W1 100 100 100 100 100 100 L2 805 455 320 180 135 250 W2 100 100 100 100 100 100 L3 610 980 1025 955 945 810 W3 470 470 470 470 470 470 L4 435 415 770 910 935 660 W4 470 470 470 470 470 470 Rloss (dB) -10 -10 -10 -10 -10 -10
Ref. : DSCHA2693QAG6332 - 28 Nov 06
11/12
Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHA2693-QAG
18-30GHz Low Noise Amplifier
Ordering Information
QFN 3x3 RoHS compliant package: CHA2693-QAG/XY Stick: XY = 20 Tape & reel: XY = 21
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.
Ref. : DSCHA2693QAG6332 - 28 Nov 06 12/12 Specifications subject to change without notice
Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09

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